| Materials | functional nano thin film, gold / silver colloid, conductive materials, insulator thin film, electromagnetic pulse shield materials, organic electro luminescence,photonic crystal, photo catalyst, various catalyst, intelligent materials, biocompatible materials, cell sheet, paints / painting, surface-active agent, water shedding/ hydrophilic materials, anti-fouling / anti-bacterium materials, optical barrier film / plastic / coating agent, functional polymer, functional monomer / origomer,photonic polymerization initiator, EB hardening ink, plastic for precision machine, paper friction materials, slurry |
|---|---|
| Surface Processing / Coating / Joint Technology |
water shedding / hydrophilic surface processing, rheology, alumite, plating, blast processing, grinding / polish, CMP,YAG laser welding, embossment, etching,LB film, nano scale barrier film, nano porous membrane, nano lubricating film, DLC coating, ceramics / titanium / fluorine coating, dye / wire bonding, UV / EBphoto hardening, friction pressure welding, friction stir joint, normal temperature joint, adhesive / bonding / separation |
| Electronic Parts / Devices | FED, SED, organic electro luminescence display, flat panel, ink jet, various coating products, photonic switch / sensor various devices, photonic disc, hard disc,contactless IC chip, IC card, hologram, anti-counterfeit / security / attestation various products, magnet, magnetic tape, filter, fuel cell, solar battery, thin filmlithium ion rechargeable battery |
| Surface Processing / Manufacturing / Measuring Instruments |
corona / ozone / plasma surface processing instruments, surface tension / shape / roughness measuring instruments, contact angle measuring instruments,rheology-related equipment, anti-static instruments, film thickness measuring instruments, thin film coater, laminating machine, thickness / viscosity various controller,wafer fabrication/ polishing instruments, CVD instruments, sputtering / photo resist processing instruments, UV lamp, EB radiation instruments, photolithographymachine, EB lithography devices, spin developer, etching devices, ion implantation system, resist separation devices, nano imprint, electron microscope |
| Commercial firms | ¥340,000 |
|---|---|
| Public organizations & University labs | ¥180,000 |
*Fees will not include the consumption 10% tax.
*Please pay according to the payment deadline of the invoice issued after exhibit application.
Corporations : 340,000JPY / space
Government organizations / University laboratories : 180,000JPY / space
Exhibitor presentation : 150,000JPY / Seminar (45mins),100,000JPY / Seminar (30mins),
*Booth allocation is made by the organizer with consideration for order of apply, the number of booths and exhibit record.
1booth: 9 square meters (W3m X D3m X H2.7m) with Panels to separate neighboring booths
*The corner booth will only have one side wall.
*The above exhibition fee does not include the cost for installation & dismantling, decoration, booth cleaning & disposal and the charges for electricity/water supply and drainage/telephone.
| Reference Price |
|---|
| 130,000 JPY ~ (tax not included) |
| Items | Qty | |
|---|---|---|
| Display Cabinets with Sliding Doors |
(W990×D700×H750) | 2unit |
| Reception Counter | (W900×D450×H800) | 1unit |
| Fascia Board | (H300) | 3m |
| Name Plate *Gothic Font | (W1200×H200) | 1unit |
| Folding Chairs | 2unit | |
| Brochure Stand | A4 vertical size/12 shelves | 1unit |
| Name Card Box | 1unit | |
| Spot Lights | 100W | 3unit |
| Carpet | including setup fees | 9m2 |
| Electric Supply | including electric usage fees | 1kW |
| Power Socket | 2 outlets (MAX 700W) | 1unit |
| Trash Can | 1unit | |
Package Booth Plan for 2-3 booths coming soon
Please refer to the Floor Layout on our website and indicate the space number you require in the application form and send it to the Secretariat by Fax.
After your application is completed, the exhibitor name and the booth location will be placed on the website on the next day.
* Please note that applications will close when all space is allocated even before the deadline.
In principle, applications cannot be cancelled after July 31, 2023.Only when the Secretariat deems itunavoidable, the cancellation will be accepted. In such cases the following penalties will be incurred based on the date written notice of cancellation is received.
| Based on the date of cancellation |
Cancellation fee |
|---|---|
| Until July 31, 2023 | 0% of the invoiced amount (including taxes). |
| From Aug 1 to Sep.30, 2023 |
50% of the invoiced amount (including taxes). |
| From Oct. 1, 2023 | 100% of the invoiced amount (including taxes). |
| Deadline for application | September 29, 2023 |
|---|---|
| Deadline for Payment | October 31, 2023 |
| Move in | January 29-30, 2024 |
| Exhibition | January 31-February 2, 2024 |
ASTEC executive committee
Secretariat of ASTEC Executive Committee
c/o JTB Communication Design，Inc.
Celestine Shiba Mitsui Building, 3-23-1, Shiba, Minato-ku, Tokyo, Japan 105-8335
Phone:+81-3-5657-0850
Fax:+81-3-5657-0645
Email:
astec@jtbcom.co.jp
[Contact Us]Secretariat of SURTECH Executive Committee (c/o JTB Communication Design, Inc.)
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